LMK105SD472KV-V [TAIYO YUDEN]
Ceramic Capacitor, Multilayer, Ceramic, 10V, 10% +Tol, 10% -Tol, SD, 0.0047uF, Surface Mount, 0402, CHIP, ROHS COMPLIANT;
| 型号： | LMK105SD472KV-V |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | Ceramic Capacitor, Multilayer, Ceramic, 10V, 10% +Tol, 10% -Tol, SD, 0.0047uF, Surface Mount, 0402, CHIP, ROHS COMPLIANT |
| 文件： | 总15页 (文件大小：1772K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
超低歪積層セラミックコンデンサ（CFCAP®）
SUPER LOW DISTORTION MULTILAYER CERAMIC
®
CAPACITORS
(CFCAP )
OPERATING TEMP.
－55～＋125℃
特長ꢀFEATURES
・新規開発を行った誘電体材料を使用し優れた温度特性と内部電極にNiを
用いることで、小型・高容量・低コストを実現しました
・低歪み率、低ショックノイズでアナログ回路や携帯機器のデジタル回路
に最適です
・耐熱性、耐破壊電圧、機械的強度が高くフィルムコンデンサの置き換え
に最適です
・Newly developed dielectric material and the use of nickel for internal
electrodes provide excellent temperature characteristics with high ca-
pacitance, small case size and low cost.
・Low distortion and low shock noise make these capacitors well suited
for use in analog or digital mobile devices.
・Excellent heat-resistance, high break down voltage, and mechanical
strength make these capacitors well suited for replacing film capacitors.
用途ꢀAPPLICATIONS
・AV関連機器などの信
号回路
号のカップリング用途
・携帯電話のPLL回路
・Signal line for AV products
・アナログ信
・Analog signal coupling applications
・PLL circuit of mobile phones
・良好な温度特性による時定数回路、発信
回路、フィルタなど
・Good temperature characteristics for time constant circuits, oscillation
circuits and filters
形名表記法ꢀORDERING CODE
1
3
5
7
9
端子電極
シリーズ記号
容量許容差
個別仕様
定格電圧〔VDC〕
U
G
T
50
35
25
16
10
K
メッキ品 SD スタンダード
K ±10 %
－ 標準
10
4
6
8
E
L
包装
T
F
形状寸法（EIA）L×W（mm）
公称静電容量（μF）
製品
厚
み（mm）
例
223
104
リールテーピング（4mmピッチ）
リールテーピング（2mmピッチ）
105（0402）
107（0603）
212（0805）
316（1206）
1.0×0.5
1.6×0.8
2.0×1.25
3.2×1.6
V
A
D
F
0.5
0.8
0.022
0.1
2
0.85
シリーズ名
1.15
1.25
1.6
11
M
積層コンデンサ
G
L
当社管理記号
○
標準品
○＝スペース
_
T M K 3 1 6 S D 1 0 4 K L
T ○
6
1
2
3
4
5
7
8
9
10
11
1
3
5
7
9
Special code
End termination
Series Symbol
SD
Capacitance tolerances（％）
Rated voltage〔VDC〕
U
G
T
E
L
50
35
25
16
10
K
Plated
K
±10
－
Standard products
Standard
10
Packaging
4
6
8
Dimensions(case size)（mm）
Nominal capacitance（μF）
example
223
104
Thickness（mm）
T
F
Tape & ree（l 4mm pitches）
Tape & ree（l 2mm pitches）
105（0402）
107（0603）
212（0805）
316（1206）
1.0×0.5
1.6×0.8
2.0×1.25
3.2×1.6
V
A
D
F
G
L
0.5
0.8
0.85
1.15
1.25
1.6
0.022
0.1
2
Series name
11
Multilayer ceramic
capacitors
Internal code
M
○
Standard products
＝Blank space
○
68
外形寸法ꢀEXTERNAL DIMENSIONS
Type（EIA）
L
W
T
e
□MK105
(0402)
□MK107
(0603)
1.0±0.05
0.5±0.05
0.5±0.05
0.25±0.10
（0.010±0.004）
0.35±0.25
V
A
D
G
F
（0.039±0.002）（0.020±0.002） （0.020±0.002）
1.6±0.10
ꢀ0.8±0.10
0.8±0.10
（0.063±0.004）（0.031±0.004） （0.031±0.004）
0.85±0.10
（0.014±0.010）
□MK212
(0805)
2.0±0.10
（0.079±0.004）（0.049±0.004）
1.25±0.10
（0.033±0.004）
1.25±0.10
0.5±0.25
（0.020±0.010）
（0.049±0.004）
1.15±0.10
4
＋
0.35
□MK316
(1206)
3.2±0.15
（0.126±0.006）（0.063±0.006）
1.6±0.15
（0.045±0.004）
1.6±0.20
0.500000
－0.25
（0.020－＋ꢀꢀꢀ）
0.014
0.010
L
（0.063±0.008）
Unit：mm (inch)
概略バリエーションꢀAVAILABLE CAPACITANCE RANGE
Type
Temp.Char
VDC
[pF:3digits]
391
471
561
681
821
102
122
152
182
222
272
332
392
105
SD
107
SD
212
SD
316
SD
Cap
[μF]
50V
25V
16V
10V
50V
25V
16V
10V
50V
35V
16V
10V
35V
25V
0.00039
0.00047
0.00056
0.00068
0.00082
0.001
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01
V
V
V
V
V
V
V
A
A
A
A
A
A
A
V
V
V
V
V
V
V
A
A
D
D
D
D
D
D
472
562
682
822
A
A
A
A
103
0.012
0.015
0.018
0.022
123
153
183
223
D
D
G
G
G
A
A
A
A
0.027
273
0.033
0.039
333
393
D
F
F
0.047
0.056
0.068
0.082
473
563
683
823
D
F
F
F
L
L
G
G
G
0.1
104
※グラフ記号は製品
厚
みを表します。
Letters in the table indicate thickness.
シリーズコード
静電容量許容差〔％〕
tanδ〔％〕
Series Code
Capacitance tolerance
Dissipation factor
SD
±10（K）
0.1max.
セレクションガイド
アイテム一覧
特性図
梱包
信頼性 使用上の注意
Selection Guide
Part Numbers
Electrical Characteristics
Packaging
Reliability Data
Precautions
P.10
P.70
P.71
P.98
P.72
P.108
69
アイテム一覧 PART NUMBERS
■105TYPE（0402 case size）
定ꢀ格
EHS
公ꢀꢀ称
温度特性
tanδ
実装条件
静電容量
許 容 差
形ꢀꢀ名
電ꢀ圧
厚 ꢀみ
（Environmental 静電容量
Temperature Dissipation Soldering method
Hazardous Capacitance characteristics
factor
R:リフロー Reflow soldering Capacitance Thickness
Rated Voltage
Ordering code
Substances）
〔μF〕
Standard type 〔%〕Max. W:フロー Wave soldering tolerance 〔mm（〕inch）
UMK105 SD391KV
UMK105 SD471KV
UMK105 SD561KV
TMK105 SD681KV
TMK105 SD821KV
TMK105 SD102KV
TMK105 SD122KV
EMK105 SD152KV
EMK105 SD182KV
EMK105 SD222KV
EMK105 SD272KV
LMK105 SD332KV
LMK105 SD392KV
LMK105 SD472KV
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.00039
0.00047
0.00056
0.00068
0.00082
0.0010
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
50V
25V
0.5±0.05
（0.020±0.002）
±10％*
Standard type
0.1
R
16V
10V
*：J公差（±5%）も対応致します。御相談ください。ꢀꢀꢀ*：The product with "J" tolerance of ±5% is also available. Please contact our local sales.
■107TYPE（0603 case size）
定ꢀ格
電ꢀ圧
EHS
公ꢀꢀ称
温度特性
tanδ
実装条件
静電容量
許 容 差
形ꢀꢀ名
厚 ꢀみ
（Environmental 静電容量
Temperature Dissipation Soldering method
Hazardous Capacitance characteristics
factor
R:リフロー Reflow soldering Capacitance Thickness
Rated Voltage
Ordering code
Substances）
〔μF〕
Standard type 〔%〕Max. W:フロー Wave soldering tolerance 〔mm（〕inch）
UMK107 SD102KA
UMK107 SD122KA
UMK107 SD152KA
UMK107 SD182KA
UMK107 SD222KA
UMK107 SD272KA
UMK107 SD332KA
TMK107 SD392KA
TMK107 SD472KA
EMK107 SD562KA
EMK107 SD682KA
EMK107 SD822KA
EMK107 SD103KA
LMK107 SD123KA
LMK107 SD153KA
LMK107 SD183KA
LMK107 SD223KA
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.0010
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.010
50V
0.8±0.1
（0.031±0.004）
25V
16V
±10％*
Standard type
0.1
R
0.012
0.015
0.018
0.022
10V
*：J公差（±5%）も対応致します。御相談ください。ꢀꢀꢀ*：The product with "J" tolerance of ±5% is also available. Please contact our local sales.
■212TYPE（0805 case size）
定ꢀ格
電ꢀ圧
EHS
公ꢀꢀ称
温度特性
tanδ
実装条件
静電容量
許 容 差
形ꢀꢀ名
厚 ꢀみ
（Environmental 静電容量
Temperature Dissipation Soldering method
Hazardous Capacitance characteristics
factor
R:リフロー Reflow soldering Capacitance Thickness
Rated Voltage
Ordering code
Substances）
〔μF〕
Standard type 〔%〕Max. W:フロー Wave soldering tolerance 〔mm（〕inch）
UMK212 SD392KD
UMK212 SD472KD
UMK212 SD562KD
UMK212 SD682KD
UMK212 SD822KD
UMK212 SD103KD
GMK212 SD123KD
GMK212 SD153KD
GMK212 SD183KG
GMK212 SD223KG
GMK212 SD273KG
EMK212 SD333KD
LMK212 SD473KD
LMK212 SD683KG
LMK212 SD823KG
LMK212 SD104KG
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.0039
0.0047
0.0056
0.0068
0.0082
0.01
0.012
0.015
0.018
0.022
0.027
0.033
0.047
0.068
0.082
0.1
50V
0.85±0.1
（0.033±0.004）
Standard type
0.1
R
±10％*
35V
1.25±0.1
（0.049±0.004）
0.85±0.1
（0.033±0.004）
16V
10V
1.25±0.1
（0.049±0.004）
*：J公差（±5%）も対応致します。御相談ください。ꢀꢀꢀ*：The product with "J" tolerance of ±5% is also available. Please contact our local sales.
■316TYPE（1206 case size）
定ꢀ格
電ꢀ圧
EHS
公ꢀꢀ称
温度特性
tanδ
実装条件
静電容量
許 容 差
形ꢀꢀ名
厚 ꢀみ
（Environmental 静電容量
Temperature Dissipation Soldering method
Hazardous Capacitance characteristics
factor
R:リフロー Reflow soldering Capacitance Thickness
Rated Voltage
Ordering code
Substances）
〔μF〕
Standard type 〔%〕Max. W:フロー Wave soldering tolerance 〔mm（〕inch）
GMK316 SD333KF
GMK316 SD393KF
TMK316 SD473KF
TMK316 SD563KF
TMK316 SD683KF
TMK316 SD823KL
TMK316 SD104KL
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.033
0.039
0.047
0.056
0.068
0.082
0.1
35V
1.15±0.1
（0.045±0.004）
±10％*
Standard type
0.1
R
25V
1.6±0.2
（0.063±0.008）
*：J公差（±5%）も対応致します。御相談ください。ꢀꢀꢀ*：The product with "J" tolerance of ±5% is also available. Please contact our local sales.
70
容量温度特性 Capacitance-temperature characteristics
20
15
10
SD : Standard Type
5
0
-
5
-
10
-
15
-
20
4
-
60
-
-
40 20
0
20
40 60
80 100 120
71
梱包ꢀPACKAGING
①最小受注単位数 Minimum Quantity
■テーピング梱包ꢀ Taped packagingꢀ
標準数量
製品
厚 み
Standard quantity
[ pcs ]
形式（EIA）
Thickness
Type
紙テープ エンボステープ
code
mm（inch）
paper
Embossed tape
□MK04（2 01005
）
0.2（0.008）
0.3（0.012）
0.3（0.012）
0.45（0.018）
0.3（0.012）
C
P
15000
̶
□MK063（0201）
15000
10000
10000
10000
̶
̶
̶
̶
P
□2K09（6 0302）
K
□WK105（0204）
□MK105（0402）
□VK105（0402）
P
V, W
W
K
0.5（0.020）
0.45（0.018）
0.5（0.020）
4000
̶
4000
V
̶
□MK107（0603）
□WK10（7 0306）
A
0.8（0.031）
4000
̶
Z
4000
4000
4000
4000
4000
̶
4000
4000
4000
̶
̶
̶
̶
̶
3000
̶
̶
0.5（0.020）
0.8（0.031）
0.6（0.024）
0.45（0.018）
0.85（0.033）
1.25（0.049）
0.85（0.033）
0.85（0.033）
0.85（0.033）
1.15（0.045）
1.25（0.049）
1.6（0.063）
0.85（0.033）
1.15（0.045）
1.5（0.059）
1.9（0.075）
2.0ma（x 0.079）
2.5（0.098）
2.5（0.098）
V
A
□2K11（0 0504）
B
K
□MK212（0805）
□WK21（2 0508）
D
G
D
D
D
F
□4K21（2 0805）
□2K21（2 0805）
̶
□MK316（1206）
□WK31（6 0612）
̶
̶
3000
2000
※□WK
G
L
D
F
③バルクカセットꢀBulk Cassette
̶
2000
H
N
Y
□MK325（1210）
□MK432（1812）
̶
̶
̶
2000
500,1000
500
M
M
※プレスポケットタイプは、
ꢀボトムテープ無し。
②テーピング材質ꢀTaping material
Unit：mm（inch）
105, 107, 212形状で個
別対応致しますのでお問い合せ下さい。
Please contact any of our offices for accepting your requirement accord-
ing to dimensions 0402, 0603, 0805.(inch)
※□WK
98
梱包ꢀPACKAGING
③テーピング寸法ꢀTaping dimensionsꢀ
ꢀ紙テープꢀPaper Tape（8mm幅（）0.315inches wide）
エンボステープꢀEmbossed tape（8mm幅（）0.315inches wide）
部品
挿入角穴
4
T1
2.0±0.05 2.0±0.05
チップ挿入部
挿入ピッチ
テープ厚 み
Type
Chip Cavity
Insertion Pitch Tape Thickness
（ＥＩＡ）
Ａ
Ｂ
Ｆ
Ｔ
T1
チップ挿入部
Chip cavity
挿入ピッチ テープ厚 み
0.25
（0.010）
0.45
2.0±0.05
0.36max.
0.27max.
Type
□MK042（01005）
□MK063（0201）
□WK105（0204）
Insertion Pitch Tape Thickness
（0.018） （0.079±0.002） （0.014） （0.011）
（EIA）
A
B
F
K
T
0.37
（0.016）
0.67
2.0±0.05
0.45max.
0.42max.
1.0
1.8
1.3max. 0.25±0.1
（0.027） （0.079±0.002） （0.018） （0.017）
□WK107（0306）
□MK212（0805）
□MK316（1206）
（0.039） （0.071）
1.655 2.4
（0.065） （0.094）
2.0 3.6
（0.079） （0.142）
（0.051max.）（0.01±0.004）
0.65
（0.026）
1.15
2.0±0.05
0.45max 0.42max
（0.045） （0.079±0.002）（0.018max）（0.017max）
4.0±0.1
Unit：mm（inch）
（0.157±0.004）3.4max. 0.6max.
（0.134max.）（0.024max.）
部品
挿入角穴
2.8
3.6
□MK325（1210）
（0.110） （0.142）
Unit：mm（inch）
エンボステープꢀEmbossed tape（12mm幅（）0.472inches wide）
2.0±0.05 2.0±0.05
チップ挿入部
Chip Cavity
挿入ピッチ テープ厚 み
Type
Insertion Pitch Tape Thickness
（EIA）
A
B
F
T
0.72
（0.028）
0.655
1.02
52.0±0.05 0.45max.(0.018max)
□2K096（0302）
□MK105（0402）
（0.040） （0.079±0.002）0.6max.(0.024max)
1.155
52.0±0.05
0.8max.
□VK105（0402） （0.026）
（0.045） （0.079±0.002）（0.031max.）
Unit：mm（inch）
チップ挿入部
Chip cavity
挿入ピッチ テープ厚 み
Type
Insertion Pitch Tape Thickness
（EIA）
A
B
F
K
T
3.7
4.9
8.0±0.1
4.0max. 0.6max.
□MK432（1812）
（0.146）
（0.193） （0.315±0.004） （0.157max.）（0.024max.）
Unit：mm（inch）
チップ挿入部
Chip Cavity
挿入ピッチ テープ厚 み
Type
Insertion Pitch Tape Thickness
（EIA）
A
B
F
T
□MK10（7 0603）
□WK10（7 0306）
1.0
1.8
4.0±0.1
1.1max.
（0.039）
1.15
（0.071） （0.157±0.004） （0.043max.）
1.55
4.0±0.1
1.0max.
□2K110（0504）
（0.045）
（0.061） （0.157±0.004） （0.039max.）
□MK212（0805）
□WK212（0508）
1.655
2.4
□4K212（0805） （0.065）
□2K212（0805）
（0.094）
4.0±0.1
1.1max.
（0.157±0.004） （0.043max.）
□MK316（1206）
□WK316（0612）
2.0
3.6
（0.079）
（0.142）
Unit：mm（inch）
99
梱包ꢀPACKAGING
④リーダー部／空部ꢀLeader and Blank portionꢀ
160mm以上
（6.3inches or more
100mm以上
）
（3.94inches or more）
引き出し方向
Direction of tape feed
400mm以上
（15.7inches or more）
⑤リール寸法ꢀReel sizeꢀ
⑥トップテープ強度ꢀTop Tape Strengthꢀ
トップテープのはがし力は下図矢印方向にて0.1～0.7Nとなります。
The top tape requires a peel-off force of 0.1～0.7N in the direction of the
arrow as illustrated below.
100
RELIABILITY DATA
1/2
Super Low Distortion Multilayer Ceramic Capacitors（CFCAP）
Item
Specified Value
Test Methods and Remarks
1.Operating Temperature Range
2.Storage Temperature Range
3.Rated Voltage
－55 to ＋125℃
－55 to ＋125℃
10VDC, 16VDC, 25VDC, 35VDC, 50VDC,
No breakdown or damage
4
4.Withstanding Voltage
Between terminals
Applied voltage: Rated voltage×3
Duration: 1 to 5 sec.
Charge/discharge current: 50mA max.
Applied voltage: Rated voltage
Duration: 60±5 sec.
5.Insulation Resistance
10000 MΩ or 500MΩμF, whichever is smaller
Charge/discharge current: 50mA max.
Measuring frequency：1ｋHz±10%
Measuring voltage：1±0.2Vrms
Bias application: None
6.Capacitance（Tolerance）
±10%
7.Tangent of Loss Angle
（tan δ）
0.1%
max
Measuring frequency：1ｋHz±10%
Measuring voltage：1±0.2Vrms
Bias application: None
8.Resistance to Flexure of
Appearance: No abnormality
Warp: 1mm
Substrate
Capacitance change: ±5%
Speed: 0.5mm/second
Duration:10 seconds
The measurement shall be made with the board in the bent position.
R-230
9. Body strength
10. Adhesion of electrode
No separation or indication of separation of electrode.
Applied force: 5N
Duration: 30 ±5 seconds
11. Solderability
At least 95% of terminal electrode is covered by new solder.
Solder temp.: 230 ±5℃
Duration: 4 ±1 seconds
12. Resistance to soldering
Apppearance: No abnormality
Solder temp.: 270 ±5℃
Capacitance change: ±2.5% max.
tanδ: Initial value
Duration: 3 ±0.5 seconds
Preheating conditions: 80 to 100℃, 2 to 5 min. or 5 to 10 min.
150 to 200℃, 2 to 5 min. or 5 to 10 min.
Recovery: Recovery for the following period under the
standard condition after the test: 24 ±2hrs
Insulation resistance: Initial value
Withstanding voltage（between terminals）: No abnormality
13. Thermal shock
Appearance: No abnormality
Conditions for 1 cycle:
+0
Capacitance change: ±2.5% max
tanδ: Initial value
Step 1: Minimum operating temperature－ ℃ 30±3 minutes
3
Step 2: Room temperature
2 to 3min.
Step 3: Maximum operating temperature－ ℃30±3 minutes
0
+3
Insulation resistance: Initial value
Withstanding voltage（between terminals）: No abnormality
Step 4: Room temperature
Number of cycles: 5 times
Recovery after the test: 24±2hrs
Temperature:40±2℃
2 to 3min.
14. Damp heat（steady state）
Appearance: No abnormality
Capacitance change: ±5% max
tanδ: 0.5% max
Humidity:90 to 95% RH
+24
Duration:500 － hrs
0
Insulation resistance 50MΩμF or 1000MΩ whichever is smaller
Recovery: Recovery for the following period under the stan-
dard condition after the removal from test chamber: 24 ±2hrs
73
RELIABILITY DATA
2/2
Super Low Distortion Multilayer Ceramic Capacitors（CFCAP）
Item
Specified Value
Test Methods and Remarks
15.Loading under Damp Heat
Appearance: No abnormality
According to JIS C 5102 clause 9.9.
Temperature:40±2℃
Capacitance change: ±7.5% max
tanδ：0.5% max
Humidity:90 to 95% RH
4
+24
Insulation resistance: 25MΩμF or 500MΩ whichever is smaller
Duration:500－ hrs
0
Applied voltage: Rated voltage
Charge/discharge current:50mA max
Recovery: Recovery for the following period under the stan-
dard condition after the removal from test chamber: 24±2hrs
16.Loading at High Tempera-
Appearance: No abnormality
According to JIS C 5102 clause 9.9.
ture
Capacitance change: ±3% max
Temperature:125±3℃
+48
tanδ：0.35% max
Duration:1000
hrs
0
－
Insulation resistance: 50MΩμF or 1000MΩ whichever is smaller
Applied voltage: Rated voltage x 2
Recovery: Recovery for the following period under the stan-
dard condition after the removal from test chamber: 24±2hrs
Note on standard condition: "standared condition" referred to herein is defined as follows.
Temperature: 5 to 35℃, Relative humidity: 45 to 85 %, Air pressure: 86 to 106kpa,
When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 %, Air pressure: 86 to 106kpa
Unless otherwise specified,all the tests are conducted under the "standard condition."
75
PRECAUTIONS
1/6
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
1.Circuit Design
Verification of operating environment, electrical rating and per-
formance
1. A malfunction in medical equipment, spacecraft, nuclear
reactors, etc. may cause serious harm to human life or have
severe social ramifications. As such, any capacitors to be
used in such equipment may require higher safety and/or
reliability considerations and should be clearly differentiated
from components used in general purpose applications.
4
Operating Voltage（Verification of Rated voltage）
1. The operating voltage for capacitors must always be lower
than their rated values.
If an AC voltage is loaded on a DC voltage, the sum of the
two peak voltages should be lower than the rated value of
the capacitor chosen. For a circuit where both an AC and a
pulse voltage may be present, the sum of their peak voltages
should also be lower than the capacitor's rated voltage.
2. Even if the applied voltage is lower than the rated value, the
reliability of capacitors might be reduced if either a high fre-
quency AC voltage or a pulse voltage having rapid rise time
is present in the circuit.
1.The following diagrams and tables show some examples of recommended patterns to
prevent excessive solder amourts.（larger fillets which extend above the component
end terminations）
2.PCB Design
Pattern configurations
（Design of Land-patterns）
1. When capacitors are mounted on a PCB, the amount of
solder used（size of fillet）can directly affect capacitor per-
formance. Therefore, the following items must be carefully
considered in the design of solder land patterns:
（1）The amount of solder applied can affect the ability of
chips to withstand mechanical stresses which may lead
to breaking or cracking. Therefore, when designing
land-patterns it is necessary to consider the appropri-
ate size and configuration of the solder pads which in
turn determines the amount of solder necessary to form
the fillets.
Examples of improper pattern designs are also shown.
（1）Recommended land dimensions for a typical chip capacitor land patterns for PCBs
Recommended land dimensions for wave-soldering（unit: mm）
（2）When more than one part is jointly soldered onto the
same land or pad, the pad must be designed so that each
component's soldering point is separated by solder-resist.
Type
107
1.6
0.8
212
2.0
316
3.2
1.6
325
3.2
2.5
L
Size
W
51.25
A
0.8～1.0 1.0～1.4 1.8～2.5 1.8～2.5
0.5～0.8 0.8～1.5 0.8～1.7 0.8～1.7
0.6～0.8 0.9～1.2 1.2～1.6 1.8～2.5
B
C
Recommended land dimensions for reflow-soldering（unit: mm）
Type
042
0.4
0.2
063
0.6
0.3
105
1.0
0.5
107
1.6
0.8
212
2.0
316
3.2
1.6
325
3.2
2.5
432
4.5
3.2
L
Size
W
51.25
A
0.15～0.25 0.20～0.30 0.45～0.55 0.8～1.0 0.8～1.2 1.8～2.5 1.8～2.5 2.5～3.5
0.10～0.20 0.20～0.30 0.40～0.50 0.6～0.8 0.8～1.2 1.0～1.5 1.0～1.5 1.5～1.8
0.15～0.30 0.25～0.40 0.45～0.55 0.6～0.8 0.9～1.6 1.2～2.0 1.8～3.2 2.3～3.5
B
C
Excess solder can affect the ability of chips to withstand mechanical stresses. There-
fore, please take proper precautions when designing land-patterns.
Type 212（4 circuits）
2.0
L
1.25
W
a
b
c
d
0.5～0.6
0.5～0.6
0.2～0.3
0.5
Type 212（2 circuits） 110（2 circuits）096（2 circuits）
L
2.0
1.37
1.0
0.9
0.6
1.25
W
a
b
c
d
0.5～0.6
0.5～0.6
0.5～0.6
1.0
0.35～0.45 0.25～0.35
0.55～0.65 0.15～0.25
0.3～0.4
0.64
0.15～0.25
0.45
109
PRECAUTIONS
2/6
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
LWDC Recommended land dimensions for reflow-soldering
4
105
1.0
107
51.6
0.8
212
2.0
316
3.2
1.6
Type
W
0.52
1.25
L
A
B
C
0.18～0.22 0.25～0.3 0.5～0.7 0.8~1.0
0.2～0.25 0.3～0.4 0.4～0.5 0.4~0.5
0.9～1.1 1.5～1.7 1.9～2.1 3.0～3.4
（unit: mm）
2.PCB Design
（2）Examples of good and bad solder application
Not recommended
Recommended
Items
Mixed mounting
of SMD and
leaded compo-
nents
Component
placement close
to the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Pattern configurations
1-1. The following are examples of good and bad capacitor layout; SMD capacitors should
（Capacitor layout on panelized [breakaway] PC boards）
1. After capacitors have been mounted on the boards, chips
can be subjected to mechanical stresses in subsequent
manufacturing processes（PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave
soldering the reflow soldered boards etc.） For this reason,
planning pattern configurations and the position of SMD ca-
pacitors should be carefully performed to minimize stress.
be located to minimize any possible mechanical stresses from board warp or deflection.
Not recommended
Recommended
Deflection of
the board
1-2. To layout the capacitors for the breakaway PC board, it should be noted that the
amount of mechanical stresses given will vary depending on capacitor layout. The
example below shows recommendations for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress
on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving,
and perforation. Thus, any ideal SMD capacitor layout must also consider the PCB
splitting procedure.
111
PRECAUTIONS
3/6
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
3.Considerations for auto-
Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the
capacitors, causing damage. To avoid this, the following points should be considered
before lowering the pick-up nozzle:
matic placement
1. Excessive impact load should not be imposed on the ca-
pacitors when mounting onto the PC boards.
2. The maintenance and inspection of the mounters should be
conducted periodically.
（1）The lower limit of the pick-up nozzle should be adjusted to the surface level of the
PC board after correcting for deflection of the board.
4
（2）The pick-up pressure should be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up
nozzle, supporting pins or back-up pins should be used under the PC board. The fol-
lowing diagrams show some typical examples of good pick-up nozzle placement:
Not recommended
Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or
cracking of the capacitors because of mechanical impact on the capacitors. To avoid
this, the monitoring of the width between the alignment pin in the stopped position, and
maintenance, inspection and replacement of the pin should be conducted periodically.
Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between
the shrinkage percentage of the adhesive and that of the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much
adhesive applied to the board may adversely affect component placement, so the fol-
lowing precautions should be noted in the application of adhesives.
1. Mounting capacitors with adhesives in preliminary assembly,
before the soldering stage, may lead to degraded capacitor
characteristics unless the following factors are appropriately
checked; the size of land patterns, type of adhesive, amount
applied, hardening temperature and hardening period.
Therefore, it is imperative to consult the manufacturer of the
adhesives on proper usage and amounts of adhesive to use.
（1）Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mount-
ing & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2）The recommended amount of adhesives is as follows;
Figure
212/316 case sizes as examples
0.3mm min
a
b
c
100 ～120 μm
Adhesives should not contact the pad
113
PRECAUTIONS
4/6
Precautions on the use of Multilayer Ceramic Capacitors
Stages
4. Soldering
Precautions
Technical considerations
Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate
the flux, or highly acidic flux is used, an excessive amount of residue after soldering
may lead to corrosion of the terminal electrodes or degradation of insulation resis-
tance on the surface of the capacitors.
1. Since flux may have a significant effect on the performance
of capacitors, it is necessary to verify the following condi-
tions prior to use;
（1）Flux used should be with less than or equal to 0.1 wt%
（equivelent to chroline）of halogenated content. Flux
having a strong acidity content should not be applied.
（2）When soldering capacitors on the board, the amount of
flux applied should be controlled at the optimum level.
（3）When using water-soluble flux, special care should be
taken to properly clean the boards.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a
large amount of flux gas may be emitted and may detrimentally affect solderability. To
minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the
air, the residue on the surface of capacitors in high humidity conditions may cause a
degradation of insulation resistance and therefore affect the reliability of the compo-
nents. The cleaning methods and the capability of the machines used should also be
considered carefully when selecting water-soluble flux.
4
Soldering
1-1. Preheating when soldering
Temperature, time, amount of solder, etc. are specified in ac-
cordance with the following recommended conditions.
Heating: Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
Cooling: The temperature difference between the components and cleaning process
should not be greater than 100℃.
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concen-
trated heating or rapid cooling. Therefore, the soldering process must be conducted with
great care so as to prevent malfunction of the components due to excessive thermal shock.
Recommended conditions for soldering
[Reflow soldering]
Sn-Zn solder paste can affect MLCC reliability performance.
Please contact us prior to usage.
Temperature profile
Temperature（℃）
（Pb free soldering）
300
Peak 260℃ max
10 sec max
200
100
0
Gradually
cooling
Preheating
150℃
60 sec min
Heating above 230℃
40 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
Caution
1. The ideal condition is to have solder mass （fillet）controlled to 1/2 to 1/3 of the
thickness of the capacitor, as shown below:
Capacitor
Solder
PC board
2. Because excessive dwell times can detrimentally affect solderability, soldering du-
ration should be kept as close to recommended times as possible.
[Wave soldering]
Temperature profile
Temperature（℃）
（Pb free soldering）
300
Peak 260℃ max
10 sec max
200
100
0
Gradually
cooling
Preheating
150℃
120 sec min
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
Caution
1. Make sure the capacitors are preheated sufficiently.
2. The temperature difference between the capacitor and melted solder should not be
greater than 100 to 130℃
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the capacitors designated as for reflow sol-
dering only.
115
PRECAUTIONS
5/6
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
[Hand soldering]
4. Soldering
ꢀTemperature profile
Temperature（℃）
（Pb free soldering）
400
300
200
350℃ max
3 sec max
Gradually
cooling
⊿Ｔ
4
100
0
60 sec min
（※⊿Ｔ≦190℃（3216Type max）, ⊿Ｔ≦130℃（3225
Type min）
）
直
※It is recommended to use 20W soldering iron and
the tip is 1φor less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the capacitor.
5.Cleaning
Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue
to adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a
degradation of the capacitor's electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimen-
tally affect the performance of the capacitors.
1. When cleaning the PC board after the capacitors are all
mounted, select the appropriate cleaning solution according
to the type of flux used and purpose of the cleaning（e.g.
to remove soldering flux or other materials from the produc-
tion process.）
2. Cleaning conditions should be determined after verifying, （1）Excessive cleaning
through a test run, that the cleaning process does not affect
the capacitor's characteristics.
In the case of ultrasonic cleaning, too much power output can cause excessive vibra-
tion of the PC board which may lead to the cracking of the capacitor or the soldered
portion, or decrease the terminal electrodes' strength. Thus the following conditions
should be carefully checked;
Ultrasonic output
Below 20 W/ℓ
Below 40 kHz
Ultrasonic frequency
Ultrasonic washing period 5 min. or less
6.Post cleaning processes
1. With some type of resins a decomposition gas or chemical
reaction vapor may remain inside the resin during the hard-
ening period or while left under normal storage conditions
resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than the
capacitor's operating temperature, the stresses generated by
the excess heat may lead to capacitor damage or destruction.
The use of such resins, molding materials etc. is not recom-
mended.
Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting capacitors and
other components, care is required so as not to give any
stresses of deflection or twisting to the board.
7.Handling
2. Board separation should not be done manually, but by us-
ing the appropriate devices.
Mechanical considerations
1. Be careful not to subject the capacitors to excessive me-
chanical shocks.
（1）If ceramic capacitors are dropped onto the floor or a
hard surface, they should not be used.
（2）When handling the mounted boards, be careful that the
mounted components do not come in contact with or
bump against other boards or components.
117
PRECAUTIONS
6/6
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
8.Storage conditions
Storage
1. If the parts are stored in a high temperature and humidity environment, problems
such as reduced solderability caused by oxidation of terminal electrodes and dete-
rioration of taping/packaging materials may take place. For this reason, components
should be used within 6 months from the time of delivery. If exceeding the above
period, please check solderability before using the capacitors.
1. To maintain the solderability of terminal electrodes and to
keep the packaging material in good condition, care must
be taken to control temperature and humidity in the storage
area. Humidity should especially be kept as low as possible.
・Recommended conditions
4
Ambient temperature
Humidity
Below 30℃
Below 70% RH
The ambient temperature must be kept below 40℃. Even
under ideal storage conditions capacitor electrode solder-
ability decreases as time passes, so should be used within
6 months from the time of delivery.
・Ceramic chip capacitors should be kept where no chlorine or
sulfur exists in the air.
2. The capacitance value of high dielectric constant capacitors
（type 2 &3）will gradually decrease with the passage of time,
so this should be taken into consideration in the circuit design.
If such a capacitance reduction occurs, a heat treatment of
150℃ for 1hour will return the capacitance to its initial level.
119
相关型号：
LMK107AC6475KA-T
Capacitor, Ceramic, Chip, General Purpose, 4.7uF, 10V, ±10%, X6S, 0603 (1608 mm), 0.005"T, -55º ~ +105ºC, 7" Reel/4mm pitch
TAIYO YUDEN
LMK107B7105KA-T
Capacitor, Ceramic, Chip, General Purpose, 1uF, 10V, ±10%, X7R, 0603 (1608 mm), 0.031"T, -55º ~ +125ºC, 7" Reel/4mm pitch
TAIYO YUDEN
LMK107B7105KA8T
MLCC (High dielectric type) for Telecommunications infrastructure and Industrial equipment / Medical devices
TAIYO YUDEN
LMK107B7105KAHT
Capacitor, Ceramic, Chip, General Purpose, 1uF, 10V, ±10%, X7R, 0603 (1608 mm), 0.031"T, -55º ~ +125ºC, 7" Reel/4mm pitch
TAIYO YUDEN
LMK107B7105MA
Ceramic Capacitor, Multilayer, Ceramic, 10V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 1uF, 0603,
TAIYO YUDEN
LMK107B7105MA8T
MLCC (High dielectric type) for Telecommunications infrastructure and Industrial equipment / Medical devices
TAIYO YUDEN
©2020 ICPDF网 联系我们和版权申明